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Ripening growth kinetics of Cu6Sn5 grains in Sn-3.0Ag-0.5Cu-xTiO2/Cu solder joints during the reflow process
Tang, Yu, Luo, Shaoming, Li, Guoyuan, Yang, Zhou, Hou, ChaojunLanguage:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4038861
Date:
December, 2017
File:
PDF, 2.16 MB
english, 2017