Statistical Distribution of Through-Silicon via Cu Pumping

IEEE Transactions on Device and Materials Reliability 2017 / 9 Vol. 17; Iss. 3

Statistical Distribution of Through-Silicon via Cu Pumping

De Messemaeker, Joke, Roussel, Philippe J., Pedreira, Olalla Varela, Van der Donck, Tom, Van Huylenbroeck, Stefaan, Beyne, Eric, De Wolf, Ingrid, Stucchi, Michele, Croes, Kristof
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Volume:
17
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2017.2738154
Date:
September, 2017
File:
PDF, 2.67 MB
english, 2017
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