Study on lifetime prediction considering fatigue...

IEEJ Transactions on Electrical and Electronic Engineering 2018 / 01

Study on lifetime prediction considering fatigue accumulative effect for die-attach solder layer in an IGBT module

Lai, Wei, Chen, Minyou, Ran, Li, Xu, Shengyou, Pan, Liang-ming, Alatise, Olayiwola, Mawby, Philip
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Language:
english
Journal:
IEEJ Transactions on Electrical and Electronic Engineering
DOI:
10.1002/tee.22607
Date:
January, 2018
File:
PDF, 1.45 MB
english, 2018
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