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Eutectic-based wafer-level-packaging technique for piezoresistive MEMS accelerometers and bond characterization using molecular dynamics simulations
Aono, Takanori, Kazama, Atsushi, Okada, Ryoji, Iwasaki, Tomio, Isono, YoshitadaLanguage:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/1361-6439/aaa2d8
Date:
December, 2017
File:
PDF, 1.18 MB
english, 2017