Using GA-SVM for defect inspection of flip chips based on...

Microelectronics Reliability 2018 / 02 Vol. 81

Using GA-SVM for defect inspection of flip chips based on vibration signals

Li, Ke, Wang, Lingyu, Wu, JingJing, Zhang, Qiuju, Liao, Guanglan, Su, Lei
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Volume:
81
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.12.032
Date:
February, 2018
File:
PDF, 1.14 MB
english, 2018
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