Activation of amino-based monolayers for electroless metallization of high-aspect-ratio through-silicon vias by using a simple ultrasonic-assisted plating solution
Chen, Sung-Te, Cheng, Yu-Syun, Chang, Yiu-Hsiang, Yang, Tzu-Ming, Lee, Jyun-Ting, Chen, Giin-ShanLanguage:
english
Journal:
Applied Surface Science
DOI:
10.1016/j.apsusc.2017.12.245
Date:
January, 2018
File:
PDF, 1.34 MB
english, 2018