Investigation of the Lead-On-Chip Package’s Reliability
Tsao, P.-H., Chang, L. C., Chen, T. C., Haung, C., Chen, C. Z.Volume:
120
Year:
1998
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792613
File:
PDF, 357 KB
english, 1998