A study of thermo‐mechanical reliability of lead‐free PTH...

A study of thermo‐mechanical reliability of lead‐free PTH solder joints

Liu, Johan, Nguyen, Jennifer, Geiger, David, Rooney, Dan, Shangguan, Dongkai
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Volume:
21
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910910947462
Date:
April, 2009
File:
PDF, 500 KB
english, 2009
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