A study of thermo‐mechanical reliability of lead‐free PTH solder joints
Liu, Johan, Nguyen, Jennifer, Geiger, David, Rooney, Dan, Shangguan, DongkaiVolume:
21
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910910947462
Date:
April, 2009
File:
PDF, 500 KB
english, 2009