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A new processing technique for fabrication of ultra-thin wafer
Zeng, Yibo, Zhang, Jie, Zhou, Hui, Guo, HangLanguage:
english
Journal:
The International Journal of Advanced Manufacturing Technology
DOI:
10.1007/s00170-017-1519-z
Date:
January, 2018
File:
PDF, 2.47 MB
english, 2018