Comparison of LCC Solder Joint Life Predictions With...

Journal of Electronic Packaging 1995 Vol. 117; Iss. 2

Comparison of LCC Solder Joint Life Predictions With Experimental Data

Wen, Liang-chi, Ross, Ronald G.
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Volume:
117
Year:
1995
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792076
File:
PDF, 776 KB
english, 1995
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