![](/img/cover-not-exists.png)
[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Study of epoxy molding compound with high dielectric constant
Liu, Hongjie, Tan, Wei, Li, Lanxia, Cheng, Xingming, Wang, ZhenYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046605
File:
PDF, 1.42 MB
english, 2017