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[ASME ASME 2017 International Mechanical Engineering Congress and Exposition - Tampa, Florida, USA (Friday 3 November 2017)] Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis - Creep Behavior of a Solder Paste With Bi Addition
Ribeiro, Pedro E., Soares, Delfim F., Cerqueira, Maria F., Teixeira, Senhorinha F., Barros, Daniel A., Teixeira, José C.Year:
2017
Language:
english
DOI:
10.1115/IMECE2017-71532
File:
PDF, 2.40 MB
english, 2017