[IEEE 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Kamakura, Japan (2017.9.7-2017.9.9)] 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Single event transient in bulk MOSFETs: Original modelling for SPICE application
Rostand, N., Martinie, S., Lacord, J., Rozeau, O., Barbe, J-C., Hubert, G.Year:
2017
Language:
english
DOI:
10.23919/SISPAD.2017.8085271
File:
PDF, 637 KB
english, 2017