Erratum to: Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints
Liu, Shengfa, Hu, Zhebing, Xiong, Jieran, Tan, Guanghua, Xiong, Wenyong, Chen, Chen, Huang, ShangyuVolume:
46
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-017-5716-1
Date:
November, 2017
File:
PDF, 271 KB
2017