[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Analysis of graphene and CNT based finned TTSV and spreaders for thermal management in 3D IC
Singh, Suraj, Kumar Panigrahi, Asisa, Krishan Singh, Om, Govind Singh, ShivYear:
2016
Language:
english
DOI:
10.1109/3dic.2016.7970000
File:
PDF, 693 KB
english, 2016