Binuclear Copper Complex Ink as a Seed for Electroless...

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Advanced Materials Interfaces 2018 / 01

Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers

Farraj, Yousef, Layani, Michael, Yaverboim, Avi, Magdassi, Shlomo
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Language:
english
Journal:
Advanced Materials Interfaces
DOI:
10.1002/admi.201701285
Date:
January, 2018
File:
PDF, 2.83 MB
english, 2018
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