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Thermal, mechanical, dielectric, and morphological study of dielectric filler–based thermoplastic nanocomposites for electromechanical applications
Poudel, Anup, Walsh, Philip, Kennedy, James, Thomas, Ken, Lyons, John G, Coffey, AustinLanguage:
english
Journal:
Journal of Thermoplastic Composite Materials
DOI:
10.1177/0892705717751017
Date:
January, 2018
File:
PDF, 1.35 MB
english, 2018