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Tetraoxa-Diphosphaspiro Derivative as Suppressor for Microvia Filling by Copper Electroplating in Acidic Solution
Tao, Zhihua., He, Wei., Li, Jing, Wang, Shouxu, Chen, Yuanming, Ai, Kehua, Peng, Yongqiang, Hong, YanVolume:
164
Year:
2017
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/2.0131802jes
File:
PDF, 1.15 MB
english, 2017