[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales - Modeling the Reflow Soldering Process in PCB’s
Costa, João, Soares, Delfim, Teixeira, Senhorinha F., Cerqueira, Fátima, Macedo, Francisco, Rodrigues, Nelson, Ribas, Luis, Teixeira, José CarlosYear:
2015
Language:
english
DOI:
10.1115/IPACK2015-48720
File:
PDF, 2.07 MB
english, 2015