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Thermal Metamaterials for Heat Flow Control in Electronics
Dede, Ercan M., Zhou, Feng, Schmalenberg, Paul, Nomura, TsuyoshiLanguage:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4039020
Date:
January, 2018
File:
PDF, 13.12 MB
english, 2018