Lead-free alternatives for interconnects in...

Lead-free alternatives for interconnects in high-temperature electronics

Mallampati, Sandeep, Yin, Liang, Shaddock, David, Schoeller, Harry, Cho, Junghyun
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Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4039027
Date:
January, 2018
File:
PDF, 2.21 MB
english, 2018
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