Lead-free alternatives for interconnects in high-temperature electronics
Mallampati, Sandeep, Yin, Liang, Shaddock, David, Schoeller, Harry, Cho, JunghyunLanguage:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4039027
Date:
January, 2018
File:
PDF, 2.21 MB
english, 2018