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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Fabricating high temperature used solders with Cu@Ag core-shell micro-nano particle addition
Zhang, Tao, Liu, Yang, Zhao, Kai, Sun, FenglianYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046698
File:
PDF, 787 KB
english, 2017