[IEEE 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Washington, DC, USA (2017.8.7-2017.8.11)] 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Thunderbolt interconnect – comparing optical and copper approaches
Liu, Guobin, Gao, Jerry, Cheng, Hengju, Wu, Hui-Chin, Lau, Edmond, Yuan, Li, Krause, ChristineYear:
2017
DOI:
10.1109/ISEMC.2017.8077885
File:
PDF, 466 KB
2017