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[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes
Santos, C., Vivet, P., Thuries, S., Billoint, O., Colonna, J.-P., Coudrain, P., Wang, L.Year:
2016
Language:
english
DOI:
10.1109/3dic.2016.7970007
File:
PDF, 493 KB
english, 2016