Hotspot Thermal Management via Thin-Film Evaporation—Part...

IEEE Transactions on Components Packaging and Manufacturing Technology 2018 / 1 Vol. 8; Iss. 1

Hotspot Thermal Management via Thin-Film Evaporation—Part I: Experimental Characterization

Adera, Solomon, Antao, Dion S., Raj, Rishi, Wang, Evelyn N.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
8
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2017.2757463
Date:
January, 2018
File:
PDF, 2.03 MB
english, 2018
Conversion to is in progress
Conversion to is failed