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Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
Chang, Yuan-Wei, Cheng, Yin, Helfen, Lukas, Xu, Feng, Tian, Tian, Scheel, Mario, Di Michiel, Marco, Chen, Chih, Tu, King-Ning, Baumbach, TiloVolume:
7
Language:
english
Journal:
Scientific Reports
DOI:
10.1038/s41598-017-06250-8
Date:
December, 2017
File:
PDF, 4.36 MB
english, 2017