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Comparison of the Etch Mask Selectivity of Nickel and Copper for a Deep, Anisotropic Plasma Etching Process of Silicon Carbide (SiC)
Ozgur, Mehmet, Pedersen, Michael, Huff, MichaelVolume:
7
Year:
2018
Language:
english
Journal:
ECS Journal of Solid State Science and Technology
DOI:
10.1149/2.0121802jss
File:
PDF, 964 KB
english, 2018