Enhanced Copper Adsorption by DTPA-chitosan/alginate...

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Chemical Engineering Journal 2018 / 2

Enhanced Copper Adsorption by DTPA-chitosan/alginate Composite Beads: Mechanism and Application in Simulated Electroplating Wastewater

Huang, Yanjun, Wu, Hailing, Shao, Taikang, Zhao, Xia, Peng, Hong, Gong, Yuefa, Wan, Huihai
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Language:
english
Journal:
Chemical Engineering Journal
DOI:
10.1016/j.cej.2018.01.071
Date:
February, 2018
File:
PDF, 3.86 MB
english, 2018
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