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Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate
Sun, Fu-Long, Gao, Li-Yin, Liu, Zhi-Quan, Zhang, Hao, Sugahara, Tohru, Nagao, Shijo, Suganuma, KatsuakiLanguage:
english
Journal:
Journal of Materials Science & Technology
DOI:
10.1016/j.jmst.2018.01.016
Date:
January, 2018
File:
PDF, 756 KB
english, 2018