[IEEE 2017 IEEE 19th Electronics Packaging Technology...

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[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Reliability prediction of LED packaging by fatigue behavior of bonding wire in power cycling accelerated test

Pan, Yongjun, Zhu, Fulong, Lin, Xinxin, Wang, Fengren, Shi, Lang, Kan, Yan, Liu, Sheng, Fan, Jiajie
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Year:
2017
Language:
english
DOI:
10.1109/EPTC.2017.8277431
File:
PDF, 957 KB
english, 2017
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