Double-Sided Process for MEMS SOI Sensors With Deep...

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Journal of Microelectromechanical Systems 2018

Double-Sided Process for MEMS SOI Sensors With Deep Vertical Thru-Wafer Interconnects

Efimovskaya, Alexandra, Lin, Yu-Wei, Shkel, Andrei M.
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Year:
2018
Language:
english
Journal:
Journal of Microelectromechanical Systems
DOI:
10.1109/JMEMS.2017.2786663
File:
PDF, 5.06 MB
english, 2018
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