Wafer-Level AuSn/Pt Solid–Liquid Interdiffusion Bonding

IEEE Transactions on Components Packaging and Manufacturing Technology 2018 / 2 Vol. 8; Iss. 2

Wafer-Level AuSn/Pt Solid–Liquid Interdiffusion Bonding

Rautiainen, Antti, Vuorinen, Vesa, Heikkinen, Hannele, Paulasto-Krockel, Mervi
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Volume:
8
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2017.2780102
Date:
February, 2018
File:
PDF, 5.80 MB
english, 2018
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