[IEEE 2017 IEEE International Interconnect Technology Conference (IITC) - HsinChu, Taiwan (2017.5.16-2017.5.18)] 2017 IEEE International Interconnect Technology Conference (IITC) - 3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
Preter, Inge De, Derakhshandeh, Jaber, Nagano, Fuya, Sharifi, Shamin Houshmand, Hou, Lin, Bex, Pieter, Suhard, Samuel, Shibata, Toshiaki, Oda, Yukinori, Hashimoto, Shigeo, Lieten, Ruben, Rebibis, KennYear:
2017
Language:
english
DOI:
10.1109/iitc-amc.2017.7968950
File:
PDF, 552 KB
english, 2017