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[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Additive low temperature 3D printed electronic as enabling technology for IoT application
Stoukatch, S., Dupont, F., Seronveaux, L., Vandormael, D., Kraft, M.Year:
2017
Language:
english
DOI:
10.1109/EPTC.2017.8277554
File:
PDF, 233 KB
english, 2017