[IEEE 2017 IEEE 19th Electronics Packaging Technology...

  • Main
  • [IEEE 2017 IEEE 19th Electronics...

[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Additive low temperature 3D printed electronic as enabling technology for IoT application

Stoukatch, S., Dupont, F., Seronveaux, L., Vandormael, D., Kraft, M.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2017
Language:
english
DOI:
10.1109/EPTC.2017.8277554
File:
PDF, 233 KB
english, 2017
Conversion to is in progress
Conversion to is failed