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[IEEE 2017 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2017.12.2-2017.12.6)] 2017 IEEE International Electron Devices Meeting (IEDM) - Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Brunschwiler, T., Schlottig, G., Sridhar, A., Bezerra, P., Ruch, P., Ebejer, N., Oppermann, H., Kleff, J., Steller, W., Jatlaoui, M., Voiron, F., Pavlovic, Z., McCloskey, P., Bremner, D., Parida, P.,Year:
2017
Language:
english
DOI:
10.1109/IEDM.2017.8268322
File:
PDF, 1.38 MB
english, 2017