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IEEE Transactions on Components Packaging and Manufacturing Technology 2018

Effect of Solder Mask Surface Chemistry and Morphology on the Water Layer Formation Under Humid Conditions

Piotrowska, Kamila, Din, Rameez Ud, Jellesen, Morten Stendahl, Ambat, Rajan
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Year:
2018
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2018.2792047
File:
PDF, 2.25 MB
english, 2018
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