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[IEEE 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Haining, Hangzhou, China (2017.12.14-2017.12.16)] 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Novel application of ring-oscillator-based sensor for 3D IC temperature and IR drop monitoring
Chiou, Jin-Chern, Yang, Tzu-Sen, Tsai, Shang-WeiYear:
2017
Language:
english
DOI:
10.1109/EDAPS.2017.8277024
File:
PDF, 842 KB
english, 2017