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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Package & board level reliability study of 0.35mm fine pitch wafer level package
Sun, Peng, Liu, Jun, Xu, Cheng, Cao, LiqiangYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046464
File:
PDF, 21.22 MB
english, 2017