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[IEEE 2017 15th IEEE International New Circuits and Systems Conference (NEWCAS) - Strasbourg, France (2017.6.25-2017.6.28)] 2017 15th IEEE International New Circuits and Systems Conference (NEWCAS) - Innovative structures to test bonding alignment and characterize high density interconnects in 3D-IC
Jani, Imed, Lattard, Didier, Vivet, Pascal, Beigne, EdithYear:
2017
Language:
english
DOI:
10.1109/NEWCAS.2017.8010128
File:
PDF, 1.21 MB
english, 2017