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[IEEE 2017 IEEE International Ultrasonics Symposium (IUS) - Washington, DC, USA (2017.9.6-2017.9.9)] 2017 IEEE International Ultrasonics Symposium (IUS) - I.H.P. SAW technology and its application to microacoustic components (Invited)
Takai, Tsutomu, Iwamoto, Hideki, Takamine, Yuichi, Fuyutsume, Toshiyuki, Nakao, Takeshi, Hiramoto, Masahiro, Toi, Takanori, Koshino, MasayoshiYear:
2017
DOI:
10.1109/ULTSYM.2017.8091876
File:
PDF, 598 KB
2017