[IEEE 2017 IEEE CPMT Symposium Japan (ICSJ) - Kyoto (2017.11.20-2017.11.22)] 2017 IEEE CPMT Symposium Japan (ICSJ) - Development of extremely thin profile flip chip CSP using laser assisted bonding technology
Kim, ChoongHoe, Jung, Yanggyoo, Kim, MinHo, Yoon, TaeHo, Song, YunSeok, Na, SeokHo, Park, DongJoo, Cho, ByoungWoo, Kang, DaeByoung, Lim, KwangMo, Khim, JinYoungYear:
2017
Language:
english
DOI:
10.1109/icsj.2017.8240085
File:
PDF, 506 KB
english, 2017