[IEEE 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Haining, Hangzhou, China (2017.12.14-2017.12.16)] 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Design of Ku-band SiGe-HBT power amplifier with through-silicon-via applying 3-D EM simulation

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