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[IEEE 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Haining, Hangzhou, China (2017.12.14-2017.12.16)] 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Design of Ku-band SiGe-HBT power amplifier with through-silicon-via applying 3-D EM simulation
Cheng, Guoxiao, Li, Zhiqun, Luo, Lei, Yao, Yan, He, Xiaodong, He, BoyongYear:
2017
Language:
english
DOI:
10.1109/EDAPS.2017.8276964
File:
PDF, 373 KB
english, 2017