[IEEE 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Chengdu, China (2017.7.4-2017.7.7)] 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Defect Z-depth Determination in Flip-chip using lock-in thermography
Qiu, Wen, Zee, Bemice, Deslandes, Herve, Lai, Brian, Tien, DavidYear:
2017
Language:
english
DOI:
10.1109/IPFA.2017.8060110
File:
PDF, 464 KB
english, 2017