3D Printed Electronics With High Performance, Multi-Layered...

IEEE Access 2017 Vol. 5

3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect

Kim, Chiyen, Espalin, David, Liang, Min, Xin, Hao, Cuaron, Alejandro, Varela, Issac, Macdonald, Eric, Wicker, Ryan B.
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Volume:
5
Year:
2017
Language:
english
Journal:
IEEE Access
DOI:
10.1109/ACCESS.2017.2773571
File:
PDF, 9.88 MB
english, 2017
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