Lead-free solder wettability of oxidized-aluminum enhanced...

Soldering & Surface Mount Technology 2018 / 02 Vol. 30; Iss. 1

Lead-free solder wettability of oxidized-aluminum enhanced by Ar-H 2 plasmas for flip-chip bumping

Lin, Yung-Sen, Lin, Shiau-Min, Li, Jian-Yi, Liao, Min-Chih
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Volume:
30
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/SSMT-06-2017-0018
Date:
February, 2018
File:
PDF, 360 KB
english, 2018
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