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Latest advancement of fully additive process for 8 µm ultra-fine pitch chip-on-film (COF) by nano-size Ni–P metallization
Pun, Kelvin P. L., Ali, Lafir, Kohtoku, Makoto, Cheung, Chee-Wah, Chan, Alan H. S., Wong, C. P.Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-018-8680-5
Date:
January, 2018
File:
PDF, 2.98 MB
english, 2018