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[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - 2.5D Silicon optical interposer for 400 Gbps electronic-photonic integrated circuit platform packaging
Kim, Do-Won, Au, K. Y., Luo, Hong Yu Li. Xianshu, Ye, Yong Liang, Bhattacharya, Surya, Lo, Guo QiangYear:
2017
Language:
english
DOI:
10.1109/EPTC.2017.8277464
File:
PDF, 920 KB
english, 2017