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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Enhancement of thermal conductivity of epoxy adhesives by ball milling copper flakes
Xu, Lu, Wen, Hao-Ran, Zhang, Futao, Yuen, Matthew M.F., Fu, Xian-Zhu, Sun, Rong, Wong, Ching-PingYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046583
File:
PDF, 316 KB
english, 2017