[IEEE 2017 29th International Conference on Microelectronics (ICM) - Beirut, Lebanon (2017.12.10-2017.12.13)] 2017 29th International Conference on Microelectronics (ICM) - Investigating the effect of the density of phase change materials on cooling electronic packages
Farhat, Hussein, Mjallal, Ibrahim, Hammoud, Mohammad, Ali, Samer, Al Shaer, Ali, Assi, Ali, Assi, IbrahimYear:
2017
Language:
english
DOI:
10.1109/ICM.2017.8268831
File:
PDF, 724 KB
english, 2017