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[IEEE 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Washington, DC, USA (2017.8.7-2017.8.11)] 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - ESD susceptibility evaluation on capacitive fingerprint module
Wei, Pengyu, Marathe, Shubhankar, Zhou, Jianchi, Pommerenke, DavidYear:
2017
Language:
english
DOI:
10.1109/ISEMC.2017.8077862
File:
PDF, 730 KB
english, 2017